Description: The DOE supports the development of advanced electronics and systems for the recording, processing, storage, distribution, and analysis of experimental data that is essential to experiments and particle accelerators used for High Energy Physics (HEP) research. Areas of present interest include signal processing, event triggering, data acquisition, high speed logic arrays, and fiber optic links useful to HEP experiments and particle accelerators. Grant applications must clearly and specifically indicate their relevance to present or future HEP programmatic activities.
Although particle physics detector and data processing instrumentation typically are developed in large collaborative efforts involving national laboratories, there are efforts where small businesses can make innovative and creative contributions. Applicants are encouraged to collaborate with active high energy elementary particle physicists at universities or national laboratories to establish mutually beneficial goals.
Proposed devices must be explicitly related to future high-energy physics experiments, either accelerator or non-accelerator based, or to future uses in particle accelerators. Relevant potential improvements over existing devices and techniques must be discussed explicitly. Areas of possible improvement include radiation hardness, energy, position, and timing resolution, sensitivity, rate capability, stability, dynamic range, durability, compactness, cost, etc.
- b: Circuits and Systems for Processing Data from Particle Detectors
Description: Grant applications are sought to develop circuits and systems for rapidly processing data from particle detectors such as proportional wire chambers, scintillation counters, silicon microstrip detectors, pixilated imaging sensors, particle calorimeters, large-area photodetector arrays, cryogenic detectors, and Cerenkov counters. Representative processing functions and circuits include low noise pulse amplifiers and preamplifiers, high speed counters, time-to-amplitude converters, and local time, charge, and signal shape extraction. Compatibility with one of the widely used or evolving module interconnection standards is highly desirable, as would be low power consumption, high component density, and-or adaptability to large numbers of multiple channels.
- c: Systems for Data Analysis and Transmission
Description: Grant applications are sought to develop advanced high-speed logic arrays and microprocessor systems for fast event identification, event trigger generation, low front-end data reduction, and data processing with very high throughput capability. Such systems should be compatible with or implemented in one of the widely used or evolving module interconnection standards. Grant applications also are sought for the innovative use of radiation tolerant ultrafast fiber optic links, electro-optic modulators, and-or commodity hard high-bandwidth networks for high-rate transmission of collected data between particle detectors and data recording or control systems. Approaches of interest should demonstrate technologies that feature one or more of the following characteristics: low bit-error rate, radiation tolerance, low failure rate, low power consumption, high packing density, and the ability to handle a large number of channels at very high rates.
- d: Enhancements to Standard Interconnection Systems
Description: Grant applications are sought to develop (1) new modules that will provide capabilities not previously available; (2) technology to substantially enhance the performance of existing types of modules; (3) technology to reduce cost and increase the density of interconnection of sensors to readout electronics; and (4) components, devices, or systems that will enhance or significantly extend the capability or functionality of one of the standard systems in HEP applications. Examples include large and-or fast buffer memories, single module computer systems (either general purpose or special purpose), display modules, CMOS monolithic active pixel sensors (MAPS) or vertically integrated (3D) electronics, communication modules and systems, wireless readout systems, and disk-drive interface modules.
- e: Other
Description: In addition to the specific subtopics listed above, the Department invites grant applications in other areas relevant to this Topic