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Reliable Direct Bond Copper Ceramic Packages for High Temperature Power…

Award Information

Agency:
National Aeronautics and Space Administration
Branch:
N/A
Award ID:
95481
Program Year/Program:
2010 / SBIR
Agency Tracking Number:
094940
Solicitation Year:
N/A
Solicitation Topic Code:
S5
Solicitation Number:
N/A
Small Business Information
Sienna Technologies, Inc.
19501 144th Avenue NE Suite F-500 Woodinville, WA -
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2010
Title: Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics
Agency: NASA
Contract: NNX10CE23P
Award Amount: $100,000.00
 

Abstract:

The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500

Principal Investigator:

Ender Savrun
Principal Investigator
4254857272
ender.savrun@siennatech.com

Business Contact:

Karen Valdastri
Business Official
4254857272
karen.valdastri@siennatech.com
Small Business Information at Submission:

Sienna Technologies, Inc.
19501 144th Avenue NE, Suite F-500 Woodinville, WA 98072

EIN/Tax ID: 911724179
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No