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A Reliable Electronic Package for Space Exploration
Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX10RA23C
Agency Tracking Number: 075216
Amount:
$600,000.00
Phase:
Phase II
Program:
SBIR
Solicitation Topic Code:
X1.03
Solicitation Number:
N/A
Timeline
Solicitation Year:
2007
Award Year:
2010
Award Start Date (Proposal Award Date):
2009-11-10
Award End Date (Contract End Date):
2011-05-31
Small Business Information
19501 144th Avenue NE, Suite F-500
Woodinville, WA
98072-4423
United States
DUNS:
015577190
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Ender Savrun
Title: Principal Investigator
Phone: (425) 485-7272
Email: ender.savrun@siennatech.com
Title: Principal Investigator
Phone: (425) 485-7272
Email: ender.savrun@siennatech.com
Business Contact
Name: Karen Valdastri
Title: Business Official
Phone: (425) 485-7272
Email: karen.valdastri@siennatech.com
Title: Business Official
Phone: (425) 485-7272
Email: karen.valdastri@siennatech.com
Research Institution
N/A
Abstract
The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.
* Information listed above is at the time of submission. *