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A Reliable Electronic Package for Space Exploration

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX10RA23C
Agency Tracking Number: 075216
Amount: $600,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: X1.03
Solicitation Number: N/A
Timeline
Solicitation Year: 2007
Award Year: 2010
Award Start Date (Proposal Award Date): 2009-11-10
Award End Date (Contract End Date): 2011-05-31
Small Business Information
19501 144th Avenue NE, Suite F-500
Woodinville, WA 98072-4423
United States
DUNS: 015577190
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Ender Savrun
 Principal Investigator
 (425) 485-7272
 ender.savrun@siennatech.com
Business Contact
 Karen Valdastri
Title: Business Official
Phone: (425) 485-7272
Email: karen.valdastri@siennatech.com
Research Institution
N/A
Abstract

The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ºC to 130ºC) encountered on the Moon and Mars. Processes that were developed in Phase I to assemble the components into a hermetically sealed package will be used to package SiGe operational amplifiers. Process and materials reliability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module packages.

* Information listed above is at the time of submission. *

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