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SBIR Phase I: Innovative High Speed Electrical Chip-to-Chip Interconnects for…
- Small Business Information
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Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
- Phase 1
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Fiscal Year: 2006Title: SBIR Phase I: Innovative High Speed Electrical Chip-to-Chip Interconnects for Next Generation SystemsAgency: NSFContract: 0539139Award Amount: $99,990.00
Abstract:
This SBIR Phase I project proposes chip-to-chip interconnects that can be applied in the mother boards/ backplanes of high performance networking systems and/or computing systems, where 10 Gb/s and beyond signal speed per channel (serial) is necessary. An innovative cost-effective high speed (> 20Gb/s per channel) electrical interconnect technology, which can increase the signal carrying capacity of the board-level interconnects more than 6 times than the conventional technology is proposed. This can help to route the signal longer distances (at given signal-speed) at lower cost by using standard dielectric material. The company will investigate the design, feasibility of the concept, process development, and data analysis approaches in order to create a high speed interconnect PCB board, and each can carry the signal as high as 20 Gb/s. The proposed high speed electrical chip-to-chip interconnects will have applications in high speed PCs, high-speed servers, networking systems, gaming machines, communications systems, imaging and video systems.Small Business Information at Submission:Banpil
2953 Bunker Hill Lane Santa Clara, CA 95054EIN/Tax ID:DUNS: N/ANumber of Employees:Woman-Owned: NoMinority-Owned: NoHUBZone-Owned: No
Award Information
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Agency: National Science Foundation |
Branch: N/A |
Award ID: 80184 |
Program Year/Program: 2006 / SBIR |
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Agency Tracking Number: 0539139 |
Solicitation Year: N/A |
Solicitation Topic Code: N/A |
Solicitation Number: N/A |