Stable Panels Incorporating a Network of Distortion Lowering Evaporators
Agency / Branch:
DOD / USAF
This proposal describes a novel idea to achieve a thermally stable panel (TSP) through the coupled use of: (1) a two dimensional evaporator array hybrid loop heat pipe system, which enables component or environment power transients to be spatially leveled via evaporator heat load sharing; (2) use of sheet metal forming technology, which enables a complex evaporator flow network to be formed into a thin, bondable, hermetically-sealed layers instead of using tubing for transport lines and headers; and (3) low thermal expansion composite isogrid panels, which provides a low stress/low distortion foundation for payload mounting. The Phase I project will design, fabricate and test a breadboard system consisting of a four evaporator sheet network and a condenser. The breadboard system will be analytically modeled and the results compared to experimental testing. BENEFIT: The approach is a low cost solution to achieving lightweight, low distortion panels for mounting satellite sensors. The concept may be adaptable to providing thermal stabilization of precision optical mirrors.
Small Business Information at Submission:
Technology Assessment & Transfer, Inc.
133 Defense Highway, Suite 212 Annapolis, MD 21401
Number of Employees: