Large Format Uncooled Focal Plane Array
Black Forest Engineering has identified innovative modifications in uncooled focal plane array (UFPA) architecture and processing that allows development of large format long wavelength infrared (8-14 ?m) imaging sensors to meet future NASA system requirements for a light weight, low power, and radiation tolerant imager. These modifications allow development of bolometer-based large format UFPA, with a pixel pitch of 20-?m and 1024x768 pixel elements with sensitivity comparable to commercially available UFPAs with 30-?m pixel pitch. The identified modifications are applicable to amorphous silicon bolometer-based UFPAs, such as those manufactured by Raytheon Commercial Infrared in Dallas, Texas.
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Black Forest Engineering, LLC
1879 Austin Bluffs Pkwy Colorado Springs, CO 80918
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