Ultra-lightweight Infrared Camera
Agency / Branch:
DOD / DARPA
Uncooled focal plane array (FPA) technology has evolved such that high performance is achieved in the long wavelength infrared (LWIR) band with small pixel pitch. Small pitch, = 17 um, allows reduction in optics size and weight. Innovative folded reflective optics allows further reduction in optics thickness and weight. On-FPA analog-to-digital conversion and custom digital electronics significantly reduces power dissipation. This innovative optics, small pixel high performance uncooled FPA sensor and custom digital electronics on flexible substrates allows development of ultra-lightweight and low power cameras for use on Micro Air Vehicles (MAVs). Component packaging of thin optics, thin FPA assembly and electronics on flexible substrates creates a thin camera structure. Black Forest Engineering, on Phase I, will conduct a preliminary optics design and feasibility study to package all camera components in size < 10 mm x 30 mm x 30 mm with weight < 10 grams and power < 1 watt. The Phase I research will allow development of a LWIR camera on Phase II and integrated with MAV structural elements.
Small Business Information at Submission:
BLACK FOREST ENGINEERING, LLC
1879 Austin Bluffs Parkway Colorado Springs, CO 80918
Number of Employees: