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MULTI-GIGAHERTZ BANDWIDTH HIGH PINOUT DENSITY WAFER PROBE

Award Information

Agency:
Department of Defense
Branch:
Defense Advanced Research Projects Agency
Award ID:
9530
Program Year/Program:
1989 / SBIR
Agency Tracking Number:
9530
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Cascade Microtech, Inc.
14255 SW BRIGADOON COURT Beaverton, OR 97005
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1989
Title: MULTI-GIGAHERTZ BANDWIDTH HIGH PINOUT DENSITY WAFER PROBE
Agency / Branch: DOD / DARPA
Contract: N/A
Award Amount: $49,866.00
 

Abstract:

A MEMBRANE TYPE WAFER PROBE IS PROPOSED WHICH, AT THE END OF PHASE II, WILL ACHIEVE TRANSMISSION OF SIGNALS FROM TESTER TO DIE WITH LOW ABBRATIONS FOR A 100 PS RISETIME. CAPABILITIES WILL INCLUDE LOW-IMPEDANCE GROUND AND POWER CONTACTS, WITH LSI-LEVEL NUMBERS AND DENSITIES OF SIGNAL LINES. PHASE I WORK WILL DETERMINE THE DESIGN PARAMETERS NECESSARY FOR THESE GOALS THROUGH A SEQUENCE OF CALCULATIONS, SCALE MODELLING, AND PROTOTYPE FABRICATION AND TESTING.

Principal Investigator:

Eric W Strid
5036268245

Business Contact:

Small Business Information at Submission:

Cascade Microtech Inc
14255 Sw Brigadoon Ct - Ste C Beaverton, OR 97005

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No