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Substrate Applications in Electronic Packaging

Award Information

Agency:
Department of Defense
Branch:
Missile Defense Agency
Award ID:
18048
Program Year/Program:
1992 / SBIR
Agency Tracking Number:
18048
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
TRS Ceramics, Inc.
2820 East College Avenue State College, PA -
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1992
Title: Substrate Applications in Electronic Packaging
Agency / Branch: DOD / MDA
Contract: N/A
Award Amount: $48,416.00
 

Abstract:

Substrate materials for high performance packaging in microelectronics require thermal expansion matching to Si and GaAs chips, low dielectric constants, and processing temperatures compatible with thick film technology. Other requirements may include integrated packages incorporating a level of intelligence or multi-functionality ("smart" materials); or high temperature packaging incorporating wide bandgap semiconductors including SiC and diamond. TRS will research ceramic substrate materials in the NaZr2P3O12 (NZP) -based family of materials. This compositionally diverse family offers the ability of thermal expansion tailoring from positive through negative values. Based on the selection of low polarization cations and NZP's open structure and high molar volume, ultra-low dielectric constants may result. Further tailoring of key packaging parameters will be demonstrated through the use of glass-ceramic composite concepts. Ultimately, specific tailoring will allow novel integrated packaging.

Principal Investigator:

Joseph Fielding, Jr.
8142387485

Business Contact:

Small Business Information at Submission:

Trs Ceramics, Inc.
2820 East College Avenue, Suite J State College, PA 16801

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No