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DEVELOPMENT OF A MICROCIRCUIT GRID TECHNIQUE FOR AUTOMATED CRACK LENGTH…

Award Information

Agency:
Department of Defense 		Branch:
Air Force 		Award ID:
5631 		Program Year/Program:
1987 / SBIR
Agency Tracking Number:
5631 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
Technology Holding, LLC
4552 S THOUSAND OAK DR Salt Lake City, UT 84124-3925
View profile »
Woman-Owned: Yes
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1987
Title: DEVELOPMENT OF A MICROCIRCUIT GRID TECHNIQUE FOR AUTOMATED CRACK LENGTH MEASUREMENT FOR FATIGUE TESTING AT ELEVATED TEMPERATURES
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $49,959.00
 

Abstract:

DEVELOPMENT AND APPLICATION OF A MICROCIRCUIT GRID TECHNIQUE FOR MEASURING CRACK LENGTHS IN FATIGUE CRACK GROWTH TEST SPECIMENS IS DESCRIBED. CRACK LENGTH IS DETERMINED FROM STEPWISE CHANGES IN THE VOLTAGE OUTPUT OF THE GRID CIRCUIT CAUSED BY THE SEQUENTIAL RUPTURE OF THE MICROSTRIPS BY THE ADVANCING CRACK TIP. THE ADVANTAGES OF THE GRID TECHNIQUE AS COMPARED TO OTHER TECHNIQUES FOR MONITORING CRACK LENGTHS INCLUDE: HIGH CRACK LENGTH RESOLUTION ( M) MADE POSSIBLE BY TODAY'S ADVANCED MICROCIRCUIT TECHNOLOGY, APPLICABILITY AT ELEVATED TEMPERATURES (1200 C) BY AN APPROPRIATED SELECTION OF THE CONDUCTING METAL STRIPS, LACK OF A NEED FOR QUANTITATIVE CALIBRATION OF THE VOLTAGE OUTPUT, AND THE COMPATIBILITY TO AUTOMATE THE DATA ACQUISITION AND ANALYSIS. DIRECT COMPARISON OF FATIGUE CRACK GROWTH RATES IN METALLIC SPECIMENS MEASURED BY THE GRID TECHNIQUE AND OTHER TECHNIQUES AND THE DEVELOPMENT OF A MULTIPLE GRID TECHNIQUE ARE THE OBJECTIVES OF THE PHASE I EFFORT.

Principal Investigator:

Raymond a culter
8014865071

Business Contact:

Small Business Information at Submission:

Ceramatec Inc
2425 S 900rd W Salt Lake City, UT 84119

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No