CAD Tool Development and Design for 3D Integrated Circuits: Optimizing Thermal Effects, Delay, Placement and Routing
Agency / Branch:
DOD / DARPA
We plan to develop unique CAD design tools, which facilitate the design of 3D integrated circuits and circuit elements, as well as tools to predict the parasitic effects resulting from 3D integration. These CAD tools will use novel techniques to simultaneously simulate the temperature distribution and heating in a 3D IC and its effect on circuit performance; an efficient impulse response method to model the electromagnetic coupling between metal interconnects in a 3D IC, and the RC and RLC delays of interconnect network. For mixed signal 3D IC's, we will propose guidelines for the design of efficient passive circuit elements including 3D inductors and antennas. We will also develop optimized sub-circuit routing and placement algorithms that take local temperature, and RC, RL and RLC effects into account for laying out integrated circuits in 3D. We propose to design tools that enable use of standard simulation languages and layout software such as Verilog and Cadence for 3D integration. Finally, we plan to utilize our CAD tools and methodologies to design a new 3D IC that can be submitted for fabrication.
Small Business Information at Submission:
7101 Poplar Avenue Takoma Park, MD 20912
Number of Employees: