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Lead-free Solder Alternative Interconnect Material

Award Information

Department of Defense
Air Force
Award ID:
Program Year/Program:
2010 / SBIR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
AF 09-111
Solicitation Number:
Small Business Information
Indiana Microelectronics LLC
3000 Kent Avenue West Lafayette, IN -
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phase 1
Fiscal Year: 2010
Title: Lead-free Solder Alternative Interconnect Material
Agency / Branch: DOD / USAF
Contract: FA8650-10-M-5122
Award Amount: $95,712.00


The purpose of this work is to characterize the environmental performance of a novel anisotropic conductive adhesive for the assembly of electronic components for military and aerospace markets. Electronic components that are attached to printed circuit board substrates using the anisotropic conductive adhesive will be subjected to thermally induced stress as well as steady state high temperature and humidity conditions. Results of these tests will be compared to the environmental performance of devices attached to an identical printed circuit board substrate using eutectic solder. The outcome of the study will provide a direct comparison of the environmental performance results of the novel epoxy attachment to the performance of a standard eutectic solder attachment. BENEFIT: The anticipated benifits of the study are the development and characterization of a low cost, novel, tin and lead free solder replacement. The material has the potential to be a suitable replacement for lead based solder formulations in many applications in the military, commercial, medical and aerospace industries.

Principal Investigator:

Eric E. Hoppenjans

Business Contact:

Eric E. Hoppenjans
Small Business Information at Submission:

Indiana Microelectronics Company
5134 Brookstone Ct. Indianapolis, IN 46268

EIN/Tax ID: 311846862
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No