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Material Utilization and Waste Reduction through Kerf Recycling

Award Information

Agency:
Department of Energy
Branch:
N/A
Award ID:
89724
Program Year/Program:
2008 / SBIR
Agency Tracking Number:
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Crystal Systems, Inc.
27 Congress Street Salem, MA 01970
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2008
Title: Material Utilization and Waste Reduction through Kerf Recycling
Agency: DOE
Contract: DE-FG02-08ER85087
Award Amount: $98,390.00
 

Abstract:

Material utilization and waste reduction are primary concerns during the manufacture of solar cells and wafers. This project will develop a processing method, Fixed Abrasive Slicing Technology (FAST), in which the silicon lost to the slurry during wafer sawing can be recycled. This loss represents a huge waste of scarce silicon as well as the largest waste stream generated by solar cell wafer production. The recyclable silicon swarf produced by FAST slicing will be processed into solar grade feedstock. In Phase I, the FAST technology will be used to slice silicon and the swarf silicon will be tested. Then, this type of swarf will then be processed into solar grade silicon feedstock. Commercial Applications and other Benefits as described by the awardee: The technology should result in a reduction in wasted silicon, which would translate into an enormous increase in the supply of silicon. This increase in supply would allow the industry to grow, while reducing the waste stream generated by the industry.

Principal Investigator:

David B. Joyce
Dr.
9787450088
djoyce@crystalsystems.com

Business Contact:

Leila Panzner
Ms.
9787450088
leila@crystalsystems.com
Small Business Information at Submission:

Crystal Systems, Inc.
27 Congress Street Salem, MA 01970

EIN/Tax ID: 042740567
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No