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Material Utilization and Waste Reduction through Kerf Recycling

Award Information
Agency: Department of Energy
Branch: N/A
Contract: DE-FG02-08ER85087
Agency Tracking Number: N/A
Amount: $745,586.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2009
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): 2012-08-14
Small Business Information
27 Congress Street
Salem, MA 01970
United States
DUNS: 062191275
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 David Joyce
 Dr.
 (978) 745-0088
 djoyce@crystalsystems.com
Business Contact
 Leila Panzner
Title: Ms.
Phone: (978) 745-0088
Email: leila@crystalsystems.com
Research Institution
N/A
Abstract

A major loss of the expensive silicon used in the production of photovoltaic (PV) solar cells occurs at the wafering stage, where as much as 50% of this valuable material ends up as a disposal problem rather than being recycled. The waste results from the use of a loose abrasive used with the multi-wire slurry saws currently used to cut the silicon wafers; this abrasive contaminates the swarf silicon and eliminates the possibility of recycling this silicon. This project will develop technology for recycling the swarf silicon via a fixed diamond abrasive process called Fixed Abrasive Slicing Technology (FAST). In Phase I, silicon was wafered on a FAST machine and the recovered swarf was analyzed. The swarf was simulated in composition, phase, and particle size, and then processed in a silicon furnace to produce solar grade feedstock. In Phase II, the processing technology will be scaled-up to demonstrate a clear path to the commercialization of the fixed diamond abrasive slicing of silicon wafers. Commercial Applications and other Benefits as described by the awardee: Converting to a recyclable slicing technology would eliminate one of the largest waste streams in PV and reduce the costs and environmental impacts of PV by 50% or more. The technology should lead to a $30 million business, which could grow by over a factor of 100 as the industry converted to fixed abrasive wafering

* Information listed above is at the time of submission. *

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