USA flag logo/image

An Official Website of the United States Government

Lead-free Solder Alternative Interconnect Material

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
97322
Program Year/Program:
2010 / SBIR
Agency Tracking Number:
F093-111-2537
Solicitation Year:
N/A
Solicitation Topic Code:
AF 09-111
Solicitation Number:
N/A
Small Business Information
TPF Enterprises LLC
2771 W Lake Rd Wilson, NY 14172
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2010
Title: Lead-free Solder Alternative Interconnect Material
Agency / Branch: DOD / USAF
Contract: FA8650-10-M-5120
Award Amount: $99,490.00
 

Abstract:

Nano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.

Principal Investigator:

Alan Rae
Managing Member
7167911084
alan@tpfenterprises.us

Business Contact:

Alan Rae
Managing Member
7167911084
alan@tpfenterprises.us
Small Business Information at Submission:

TPF Enterprises LLC
2771 W Lake Rd Wilson, NY 14172

EIN/Tax ID: 264746943
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No