Lead-free Solder Alternative Interconnect Material

Award Information

Agency: Department of Defense	Branch: Air Force	Award ID: 97322	Program Year/Program: 2010 / SBIR
Agency Tracking Number: F093-111-2537	Solicitation Year: N/A	Solicitation Topic Code: AF 09-111	Solicitation Number: N/A

Small Business Information: TPF Enterprises LLC
2771 W Lake Rd Wilson, NY 14172
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Woman-Owned: No

Minority-Owned: No

HUBZone-Owned: No

Phase 1: Fiscal Year: 2010

Title: Lead-free Solder Alternative Interconnect Material

Agency / Branch: DOD / USAF

Contract: FA8650-10-M-5120

Award Amount: $99,490.00

Abstract:
Nano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.

Principal Investigator:
Alan Rae
Managing Member
7167911084
alan@tpfenterprises.us

Business Contact:
Alan Rae
Managing Member
7167911084
alan@tpfenterprises.us

Small Business Information at Submission:

TPF Enterprises LLC
2771 W Lake Rd Wilson, NY 14172

EIN/Tax ID: 264746943

DUNS: N/A

Number of Employees:

Woman-Owned: No

Minority-Owned: No

HUBZone-Owned: No