Lead-free Solder Alternative Interconnect Material
Agency / Branch:
DOD / USAF
Nano silver-coated copper pastes will be prepared and evaluated as an economic alternative to tin-lead or tin-silver copper paste for improved processability, properties and reliability combined with compatibitibility with legacy components and solder systems. BENEFIT: Compared with current lead-free solder systems these nano silver coated copper pastes will provide a lower processing temperature equivalent to tin-lead solder, acceptable economics, compliant and lightweight joints and compatibility with legacy and anticipated components and boards. The joints do not contain low-melting alloys subject to creep constraints at equipment operating temperatures, contain abundant metals and will be field processable with existing production and rework equipment.
Small Business Information at Submission:
TPF Enterprises LLC
2771 W Lake Rd Wilson, NY 14172
Number of Employees: