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Company Information:

Company Name:
Cyberoptics Corp
Address:
2331 University Avenue Se
Minneapolis, MN 55414
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
N/A
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $189,324.00 4
SBIR Phase II $207,000.00 1

Award List:

HIGH SPEED RANDOM ACCESS CAMERA

Award Year / Program / Phase:
1987 / SBIR / Phase I
Award Amount:
$49,967.00
Agency / Branch:
DOD / USAF
Principal Investigator:
Lynn d hutcheson
Abstract:
There are many military and commercial applications where very high speed and high resolution signal processing, computing, image processing and vision systems are desirable. current systems are severely limited by devices that require relatively long times to get information into and out of the… More

NON-CONTACT PENCIL PROBE FOR ADVANCED MANUFACTURING INSPECTION

Award Year / Program / Phase:
1987 / SBIR / Phase I
Award Amount:
$40,000.00
Agency:
NSF
Principal Investigator:
Abstract:
N/a

NON-CONTACT PENCIL PROBE FOR ADVANCED MANUFACTURING INSPECTION

Award Year / Program / Phase:
1988 / SBIR / Phase II
Award Amount:
$207,000.00
Agency:
NSF
Principal Investigator:
Abstract:
As the united states moves to just-in-time manufacturing, there will be increased emphasis on rapid and accurate inspection techniques. for these reasons, research aimed at the ultimate development of a high accuracy, miniature probe capable of inspecting manufactured parts with complex geometries… More

HIGH-SPEED INSPECTION SYSTEM FOR 5.56 CARTRIDGE CASINGS

Award Year / Program / Phase:
1990 / SBIR / Phase I
Award Amount:
$49,886.00
Agency / Branch:
DOD / ARMY
Principal Investigator:
Paul R Haugen
Abstract:
To ensure reliable production of cartridge casings, critical dimensions, such as the placement and size of the primer cup and vent hole, must be accurately maintained. currently, there is no ability to measure critical dimensions of the primer cup during the production of the 5.56mm cartridge… More

HIGH SPEED PROFILING OF MULTICHIP MODULE INTERCONNECTIONS

Award Year / Program / Phase:
1991 / SBIR / Phase I
Award Amount:
$49,471.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Jeff Jalkio , Principal Investigator
Abstract:
As the complexity and functionality of microelectronic components increased, standard packaging and interconnection technologies limit the development of electronic systems. to increase the density of electronic components, new techniques such as flip-chip bonding have been designed to allow… More