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Company Information:

Company Name: Cyberoptics Corp
City: Minneapolis
State: MN
Zip+4: 55414
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Website URL: N/A
Phone: N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $189,324.00 4
SBIR Phase II $207,000.00 1

Award List:

HIGH SPEED RANDOM ACCESS CAMERA

Award Year / Program / Phase: 1987 / SBIR / Phase I
Agency / Branch: DOD / USAF
Principal Investigator: Lynn d hutcheson
Award Amount: $49,967.00
Abstract:
There are many military and commercial applications where very high speed and high resolution signal processing, computing, image processing and vision systems are desirable. current systems are severely limited by devices that require relatively long times to get information into and out of the… More

NON-CONTACT PENCIL PROBE FOR ADVANCED MANUFACTURING INSPECTION

Award Year / Program / Phase: 1987 / SBIR / Phase I
Agency: NSF
Principal Investigator:
Award Amount: $40,000.00

NON-CONTACT PENCIL PROBE FOR ADVANCED MANUFACTURING INSPECTION

Award Year / Program / Phase: 1988 / SBIR / Phase II
Agency: NSF
Principal Investigator:
Award Amount: $207,000.00
Abstract:
As the united states moves to just-in-time manufacturing, there will be increased emphasis on rapid and accurate inspection techniques. for these reasons, research aimed at the ultimate development of a high accuracy, miniature probe capable of inspecting manufactured parts with complex geometries… More

HIGH-SPEED INSPECTION SYSTEM FOR 5.56 CARTRIDGE CASINGS

Award Year / Program / Phase: 1990 / SBIR / Phase I
Agency / Branch: DOD / ARMY
Principal Investigator: Paul R Haugen
Award Amount: $49,886.00
Abstract:
To ensure reliable production of cartridge casings, critical dimensions, such as the placement and size of the primer cup and vent hole, must be accurately maintained. currently, there is no ability to measure critical dimensions of the primer cup during the production of the 5.56mm cartridge… More

HIGH SPEED PROFILING OF MULTICHIP MODULE INTERCONNECTIONS

Award Year / Program / Phase: 1991 / SBIR / Phase I
Agency / Branch: DOD / DARPA
Principal Investigator: Jeff Jalkio , Principal Investigator
Award Amount: $49,471.00
Abstract:
As the complexity and functionality of microelectronic components increased, standard packaging and interconnection technologies limit the development of electronic systems. to increase the density of electronic components, new techniques such as flip-chip bonding have been designed to allow… More