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Optical "Bond Pads" For Silicon VLSI
Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 19700
Amount:
$59,088.00
Phase:
Phase I
Program:
SBIR
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Timeline
Solicitation Year:
N/A
Award Year:
1993
Award Start Date (Proposal Award Date):
N/A
Award End Date (Contract End Date):
N/A
Small Business Information
2200 Central Avenue
Boulder, CO
80301
United States
DUNS:
N/A
HUBZone Owned:
No
Woman Owned:
No
Socially and Economically Disadvantaged:
No
Principal Investigator
Name: Mark Handschy
Phone: (303) 449-8933
Phone: (303) 449-8933
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WE PROPOSE A NOVEL METHOD FOR PROVIDING OPTICAL MODULATOR PADS ON SILICON VLST CIRCUITS. OUR TECHNIQUE SHOULD ENABLE MODULATOR PAD ARRAYS OF NEARLY ARBITRARY CONFIGURATION, WITH MINIMUM PAD GEOMETRIES OF A FEW MICRONS SQUARE. MODULATOR RESPONSE TIMES LESS THAN 1 ns SHOULD BE ACHIEVED. THE TECHNIQUE REQUIRES ONLY A FEW PROCESS STEPS AND WILL WORK ON CIRCUITS MADE IN ANY STANDARD VLSI PROCESS.
* Information listed above is at the time of submission. *