You are here

Optical "Bond Pads" For Silicon VLSI

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N/A
Agency Tracking Number: 19700
Amount: $59,088.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1993
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
2200 Central Avenue
Boulder, CO 80301
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mark Handschy
 (303) 449-8933
Business Contact
Phone: () -
Research Institution
N/A
Abstract

WE PROPOSE A NOVEL METHOD FOR PROVIDING OPTICAL MODULATOR PADS ON SILICON VLST CIRCUITS. OUR TECHNIQUE SHOULD ENABLE MODULATOR PAD ARRAYS OF NEARLY ARBITRARY CONFIGURATION, WITH MINIMUM PAD GEOMETRIES OF A FEW MICRONS SQUARE. MODULATOR RESPONSE TIMES LESS THAN 1 ns SHOULD BE ACHIEVED. THE TECHNIQUE REQUIRES ONLY A FEW PROCESS STEPS AND WILL WORK ON CIRCUITS MADE IN ANY STANDARD VLSI PROCESS.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government