Hardening Electronics to Electromagnetic Threats
Agency / Branch:
DOD / DTRA
OBJECTIVE: New lower-cost technologies for hardening critical electronic systems and infrastructures against electromagnetic threats across the frequency spectrum from the various forms of the electromagnetic spectrum to the various emissions of electromagnetic spectrum (EM) (non nuclear and nuclear) to include nuclear electromagnetic pulse (EMP) and high power microwaves (HPM). This effort should focus on addressing the complex problem of strategic mobile communications systems. DESCRIPTION: Electromagnetic threats (HPM and EMP) pose problems to electronics both as conducted (e.g., wires and antennas) and radiated (e.g., apertures and cracks) threats. Over the past years a variety of techniques have been developed to protect electronics from these threats that operate over selected frequency bands. However, these techniques are frequently costly to implement and have size limitations. The desire is to develop novel techniques that are low-cost, lightweight and compact. Further, it is desirable that the techniques are applicable over a broad frequency range covering both EMP and HPM spectrums. Approaches that deal with individual conducted or radiated threats are of interest for critical systems, infrastructures, and facilities. In the area of nuclear EMP, it is desired to have conductive protection devices that cover the early time (E1), mid time (E2), and late time (E3) threat environments with one compact unit. In HPM, methods to protect the electronics directly (similar to radiation hardening electronics) would be of great interest. PHASE I: Proof of concept should be demonstrated by analysis and/or preliminary experimental device. A detailed plan for further engineering development and demonstration by testing in Phase II should also be provided. A clear Phase I to Phase II decision point must be part of the final delivery in Phase I along with a roadmap that takes the program through Phase III. PHASE II: Successfully demonstrate the operation of the prototype hardening device against specified electromagnetic threat(s) without effects on the protection device or protected circuit. Industry and government partners for Phase III must be identified along demonstrated support for the proposed design/prototype. A clear Phase II to Phase III decision point must be part of the final delivery in Phase III. PHASE III: Demonstration of EMP and HPM protection devices to meet MIL-STD 188-125-2 and other applicable military and commercial standards may result in DoD program managers funding further development of the technology. Dual use of devices for protection of both military systems and commercial facilities/civilian infrastructures from potential terrorist threats is a plus. REFERENCES: 1. MIL-STD-188-125-2; MIL-HDBK-423; High-Power-Microwave Hardening Design Guide for Systems, HDL-CR-92-709-5, April 1992, MIL-STD-464, MIL-STD-461.
Small Business Information at Submission:
2956 Waterview Drive Rochester Hills, MI 48309
Number of Employees: