Electrically Releasable Adhesives for Facilitated Recycling of Manufactured Products
79173S In assembly and manufacturing operations, adheshive bonding is one of the most energy efficient methods for joining. However, despite its many advantatages, this technique is limited because no effective method exists for disassembling adhesively bonded structures and appliances. This not only hinders repair operations but also hampers recycling operations, preventing the energy efficient recovery of materials and valuable components. Electrically releaseable adhesives can remedy this shortcomig. These adhesives form high strength bonds between metal substrates and can be released in seconds by the application of a low power current. The process allows easy disassembly of adhesively bonded structures and is conducive to use in automated recycling processes. Phase I will develop novel rapid cure versions of these adhesives, suited for use in high volume manufacturing operations. The adhesive formulations to be developed include a 2-part epoxy possessing a rapid room temperature cure, a 1-part epoxy having a rapid high temperature cure mechanism, and a 2-part or 1-part activatable acrylic. These compositions will be characterized for thermal/mechanical properties, environmental durability, and electrical debonding function. Commercial Applications and other Benefits as described by the awardee: Rapid cure, electrically releaseable adhesives should promote the use of this technology in high volume manufacturing operations. For automotive manufacturers, multiple formulations could be developed to meet the diverse requirements (under hood, under chassis and interior) for this application. Electronics and appliance manufacturers also should benefit because many appliance components could be readily recycled in the manufacture of new appliances, if they were easily recoverable by a benign disassembly process.
Small Business Information at Submission:
Eic Laboratories, Inc.
111 Downey Street Norwood, MA 02062
Number of Employees: