Waste Minimization in Circuit Board Manufacture by Powder Coating and Metallo-Organic Decomposition
Agency / Branch:
DOD / DARPA
The objective of this program is to investigate the feasibility of a novel method of fabricating printed circuit boards based on Metallo-Organic Decomposition technology. This technology was first investigated for applying metallization to solar cells by ink jet printed, For circuit board applications heavier traces are required to obtain adequate conductivity, and the present program proposes to achieve this by enhancing the printed image by powder coating additional MOD compound. The program will investigate materials for powder coating, provision of a printed image which will adhere the power, powder de-composition and production of printed circuit samples. A successful Phase I and Phase II program will provide prototype processing equipment and materials which will permit direct printing and enhancement of circuit boards without photolithography, etching or plating. Circuit boards will be produced directly from CAD files without generation of wastes of any kind. Anticipated Benefits: The technology to be investigated will provide the capability to produce custom boards or short runs and minimize inventory costs for private sector producers. For defense systems it offers an approach to direct write conformal applications such as aircraft antennas.
Small Business Information at Submission:
Principal Investigator:Paul Kydd
Partnerships Limited, Inc.
P.o. Box 6042 Lawrenceville, NJ 08648
Number of Employees: