Automated Wafer Polishing for Epi-ready Antimony-based Substrate Materials
Agency / Branch:
DOD / MDA
EPIR Technologies has experience in polishing II-VI semiconductor substrates for MBE applications. We propose to transfer this experience to the polishing of Sb-based substrates. The quality of a surface is determined by the degree of surface flatness (or curvature), smoothness, stoichiometry, and the magnitude of surface/sub-surface damage. All these parameters are addressed in this proposal. We propose to achieve an atomically smooth substrate surface by using an abrasive-free chemical polishing procedure. In order to reduce polishing damage, new sample holders with the capability of varying the load or pressure on the sample will be made since there are no commercially available jigs. We propose innovative ideas for controlling and monitoring the chemistry of the chemical polishing solutions. The ability to correctly compare the effects of different chemical solutions requires that the viscosities of the chemical solutions remain unchanged. EPIR will expand on its proprietary procedure for measuring and matching the viscosities of different polishing solutions, which will be a key issue in polishing Sb-based substrates. EPIR will carryout a full pressure-dependent/non-contact polishing study with an emphasis on comparing and optimizing chemical polishing solutions.
Small Business Information at Submission:
EPIR TECHNOLOGIES, INC.
590 Territorial Drive, Suite B Bolingbrook, IL 60440
Number of Employees: