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COPPER ELECTROCHEMICAL PLANARIZATION FOR THREE-DIMENSIONAL ADVANCED IC…

Award Information

Agency:
Department of Defense
Branch:
Air Force
Award ID:
40916
Program Year/Program:
1998 / SBIR
Agency Tracking Number:
40916
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Faraday TechNology, Inc.
315 Huls Drive Clayton, OH 45315-8983
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1998
Title: COPPER ELECTROCHEMICAL PLANARIZATION FOR THREE-DIMENSIONAL ADVANCED IC MULTICHIP MODULE AND INTERCONNECT APPLICATIONS
Agency / Branch: DOD / USAF
Contract: N/A
Award Amount: $99,907.00
 

Abstract:

The objective of the program is to develop and commercialize an electrochemical copper planarization process for three-dimensional advanced IC applications (multichip modules and interconnects) based on a modulated reverse electrochemical planarization (MREF-ECP) process. The Phase I program will demonstrate the MREF-ECP process using damascene architecture with trenches of 1 to 0.25 microns and aspect ratios of 1:1 to 3:1. These dimensional features are not currently attained using state-of-the art fabrication techniques. Further, the proposed MREF-ECP process will (1) improve through-put due to the elimination of the time consuming electropolishing step, (2) reduce capital investment with less processing sequences, and (3) minimize or eliminate the waste stream volume. The proposed MREF-ECP process is a key enabling technology for three-dimensional IC applications required by the U.S. Air Force to reduce the power, weight, volume, and cost of aircraft microelectronics.

Principal Investigator:

E Jennings Taylor Phd
9378367749

Business Contact:


0
Small Business Information at Submission:

FARADAY TECHNOLOGY, INC.
315 HULS DR Clayton, OH 45315

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No