USA flag logo/image

An Official Website of the United States Government

Electrically Medicated Microetching Manufacturing Process to Replace Emersion…

Award Information

Agency:
Department of Energy
Branch:
N/A
Award ID:
61789
Program Year/Program:
2003 / SBIR
Agency Tracking Number:
70349S02-II
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Faraday TechNology, Inc.
315 Huls Drive Clayton, OH 45315-8983
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2003
Title: Electrically Medicated Microetching Manufacturing Process to Replace Emersion and Spray Etching
Agency: DOE
Contract: DE-FG02-02ER83425
Award Amount: $0.00
 

Abstract:

70349S02-II This project will develop an electrically mediated etching technology to replace immersion and spray etching techniques used in the manufacture of large (2m x 2m to 5m x 5m), thin (100-200 mm thick), multiple-layer printed circuit boards of interest to the Department of Energy high energy physics program. Lines and spaces with dimensions down to 10 mm will be consistently etched to provide a cost-effective solution for improved electronics module designs. This approach will be compatible with commercial printed circuit-board-fabrication facilities. Phase I demonstrated that in a neutral salt electrolyte, the process met or exceeded desired performance criteria for etching small lines and spaces in a printed circuit board. The results exceeded those obtained by spray or DC etching. Phase II will further develop a mathematical model of the electrically mediated etching process and use it to develop and optimize an electrically mediated waveform library for a wide range of feature sizes. A pilot-scale Alpha test facility will be designed and developed for the fabrication of large printed circuit boards. The etching of full-size panels will be performed using that facility. Commercial Applications and Other Benefits as described by awardee: Today, microetched products with physical attributes below 75 mm experience low process yields (approx 70%). A process capable of etching lines and spaces down to 10 mm would increase yields, lower manufacturing costs, reduce material and utility consumption, reduce costs to the OEM, and provide a technology advancement that would allow higher density packaging at the printed circuit board level.

Principal Investigator:

Jenny Sun
9378367749
jennysun@faradaytechnology.com

Business Contact:

E. Jennings Taylor
9378367749
jenningstaylor@faradaytechnol
Small Business Information at Submission:

Faraday Technology, Inc.
35 Huls Drive Clayton, OH 45315

EIN/Tax ID: 311347918
DUNS: N/A
Number of Employees: N/A
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No