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Low Light Level Solid State Sensors
Phone: (805) 582-0155
In this proposed project, Fermionics Corporation will fabricate 2.0 mm, high temperature, digital, InGaAs Focal Plane Array (FPA) cameras for the U.S. Army. The FPA will be in the form of a hybrid with a minimum dimension of 256x256. Fermionics Corporation will produce the InGaAs arrays, hybridize the arrays to the digital readout multiplexers, and integrate the FPAs into cameras. During phase I, we will produce 64x64, 2.0 mm, 230o-300oK, InGaAs arrays with pixel sizes of 10, 15, and 20 mm. The InGaAs wafer used for the Phase I project will be MOCVD grown thin films on InP substrates. After fabrication, the arrays will be hybridized to fan-out chips and be extensively tested. In Phase II, Amain Electronics will design the digital readout multiplexers for the p-on-n InGaAs arrays. The criteria for the mux is small pixel size, low noise, and provides digital signals. After hybridization, the InGaAs FPAs will be incorporated into a camera provided by a selected camera producer. In Phase III, the IR cameras will be commercialized. The new FPAs will be an advanced version of current image intensifiers for military applications. They will also find markets in astronomy, nuclear detector imaging, medical studies, and spectroscopy. The FPAs may also be used in automobiles for collision avoidance and to provide warning for hazardous road conditions.
* Information listed above is at the time of submission. *