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Environmentally Conscious Solder Process for Manual/Bench Application

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 36634
Amount: $99,988.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
350 Second Avenue
Waltham, MA 02154
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Dr. Larry Felton
 (617) 684-4000
Business Contact
Research Institution
N/A
Abstract

Foster-Miller proposes the development of unique Isotropic Conducting Adhesives (ICA's) that will yield an enviromentally safe joining method for manual and bench operations. Our concept is based on the development of a proprietary technology to improve the mechanical behavior of ICA's. The technology we propose will also increase the resistance of the ICA's metal filler to oxidation, thereby improving the stability of the joint resistance, especially in harsh environments. The ICA's we develop will rely on copper, rather than silver, as the conducting medium. This advance will lower cost and eliminate concerns over silver migration. Our test plan will compare the performance of our novel ICAs to commercially available materials. Performance tests to be conducted include lap shear, junction stability in high humidity and high temperature environments, and a drop test. If successful, the ICAs that we develop will be a suitable general replacement for lead- bearing solder in electronics.

* Information listed above is at the time of submission. *

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