Development of an Accelerated Life Test for Wide-Bandgap (SiC) HEV/PHEV Power Conversion Modules
Major automobile manufacturers have expressed a strong interest in the development of high-frequency power circuits for use in emerging plug-in hybrid electric vehicles (PHEVs). However, the prediction of the life-cycle of high power SiC devices poses a unique challenge because of the higher temperature operation of these devices. This project will develop testing and evaluation methods for emerging SiC-based power devices. The first challenging task is to design, develop, and demonstrate an all-SiC converter module. Then, new SiC-based circuit models will be implemented using industry-standard circuit simulation tools. A finite element thermal model will then be implemented to provide an understanding of the stress levels induced in the power circuits under operation. Finally, comprehensive physics-based models will be developed to predict the life-cycle of power devices operating under realistic PHEV conditions. These models will be compared to the measurements conducted on the all-SiC PHEV power module. Commercial Applications and other Benefits as described by the awardee: In addition to the application to PHEVs, predictions of the life cycle performance of high power SiC devices would be applicable to a large number of military and commercial uses of these devices. Military applications include propulsion systems, emergency power systems, and aircraft avionics. Commercial applications include computer power supplies, cellular phone base station power supplies, consumer electronics, lighting applications, and robotic and motor controls.
Small Business Information at Submission:
Research Institution Information:
Genesic Semiconductor Inc.
43670 Trade Center Place Suite 155 Dulles, VA 20166
Number of Employees:
University of Illinois, Chicago
P.O. Box 5220
Chicago, IL 60680 5220
Nonprofit college or university