USA flag logo/image

An Official Website of the United States Government

High-Temperature, Wirebondless, Ultra-Compact Wide Bandgap Power Semiconductor…

Award Information

Agency:
National Aeronautics and Space Administration
Branch:
N/A
Award ID:
95371
Program Year/Program:
2010 / SBIR
Agency Tracking Number:
095450
Solicitation Year:
N/A
Solicitation Topic Code:
S3
Solicitation Number:
N/A
Small Business Information
APECOR
3259 Progress Drive, Suite A Orlando, FL 32826-2930
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2010
Title: High-Temperature, Wirebondless, Ultra-Compact Wide Bandgap Power Semiconductor Modules for Space Power Systems
Agency: NASA
Contract: NNX10CD11P
Award Amount: $99,738.00
 

Abstract:

Silicon carbide (SiC) and other wide band-gap semiconductors offer great promise of high power rating, high operating temperature, simple thermal management, and ultra-high power density for both space and commercial power electronic systems. However, this great potential is seriously limited by the lack of reliable high temperature device packaging technology. The objective of this proposed research is to develop a ultra-compact, hybrid power module packaging technology based on the use of double leadframes and direct leadframe-to-chip transient liquid phase (TLP) bonding that allows device operation up to 450oC. The Phase I research plan will include: 1) material selection; 2) electrical, mechanical, and thermal design of a half-bridge prototype module; 3) packaging process development using volume manufacturing processes; 4) stress and thermal modeling and analysis; 5) material characterization under high temperature and high temperature cycling; and 6) cost estimation and comparative analysis with competing technologies. The unique advantages of this innovative solution include very high current carrying capability, low package parasitic impedance, low thermo-mechanical stress at high temperatures, double-side cooling, and modularity for easy system-level integration. The new power module will have a very small form factor with 3-5X reduction in size and weight from the prior art.

Principal Investigator:

John C. Elmes
Principal Investigator
4072751174
jelmes@apecor.com

Business Contact:

John C. Elmes
Vice President
4072751174
jelmes@apecor.com
Small Business Information at Submission:

APECOR
3259 Progress Drive, Suite A Orlando, FL 32826

EIN/Tax ID: 593761391
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No