Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes
Agency / Branch:
DOD / MDA
Missile Defense Agency is seeking new technologies to reduce the tendency to form tin whiskers in electronic assemblies and microelectronic devices. RoHS regulations enacted by the European Union have generated a global shift toward Pb-free electronic components and circuitry. Pb-free solders create reliability problems in military applications such as aircraft and missiles that are subject to highly stressed environments by exacerbating tin whisker formation. Applied Nanotech, Inc. has developed a novel technique to simultaneously remediate existing tin whiskers and modify the underlying structure to prevent new ones from growing. Following a successful Phase I program, ANI will continue to team with its strategic partners to provide increased validation and optimization of the process for tin whisker mitigation. The Phase II program has been designed to transition the technology into a manufacturable process for commercial integration.
Small Business Information at Submission:
Research Institution Information:
Applied Nanotech, Inc.
3006 Longhorn Blvd. Suite 107 Austin, TX 78758
Number of Employees:
Center for Advanced Lifecycle Eng.
Bldg 89, room 1103
University of Maryland
College Park, MD 20742