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Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes

Award Information

Department of Defense
Missile Defense Agency
Award ID:
Program Year/Program:
2010 / STTR
Agency Tracking Number:
Solicitation Year:
Solicitation Topic Code:
MDA 08T010
Solicitation Number:
Small Business Information
3006 LONGHORN BLVD STE 107 Austin, TX 78758-7518
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Phase 2
Fiscal Year: 2010
Title: Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes
Agency / Branch: DOD / MDA
Contract: HQ0147-10-C-7203
Award Amount: $500,000.00


Missile Defense Agency is seeking new technologies to reduce the tendency to form tin whiskers in electronic assemblies and microelectronic devices. RoHS regulations enacted by the European Union have generated a global shift toward Pb-free electronic components and circuitry. Pb-free solders create reliability problems in military applications such as aircraft and missiles that are subject to highly stressed environments by exacerbating tin whisker formation. Applied Nanotech, Inc. has developed a novel technique to simultaneously remediate existing tin whiskers and modify the underlying structure to prevent new ones from growing. Following a successful Phase I program, ANI will continue to team with its strategic partners to provide increased validation and optimization of the process for tin whisker mitigation. The Phase II program has been designed to transition the technology into a manufacturable process for commercial integration.

Principal Investigator:

Mohshi Yang
PI/Chief Technical Officer

Business Contact:

Nancy Ruel
Director, Contracts & Program Mgmt.
Small Business Information at Submission:

Applied Nanotech, Inc.
3006 Longhorn Blvd. Suite 107 Austin, TX 78758

EIN/Tax ID: 742848504
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Research Institution Information:
Center for Advanced Lifecycle Eng.
Bldg 89, room 1103
University of Maryland
College Park, MD 20742
Contact: Mike Osterman
Contact Phone: 3014055323