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Wafer Bumping for Ultra-High Data Transfer Rates in Multi-Chip Modules with…

Award Information

Agency:
Department of Defense 		Branch:
Navy 		Award ID:
83436 		Program Year/Program:
2007 / STTR
Agency Tracking Number:
N074-018-0350 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
HYPRES. Inc.
175 CLEARBROOK RD ELMSFORD, NY -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2007
Title: Wafer Bumping for Ultra-High Data Transfer Rates in Multi-Chip Modules with Superconducting Integrated Circuits
Agency / Branch: DOD / NAVY
Contract: N00014-07-M-0369
Award Amount: $69,963.00
 

Abstract:

Superconducting integrated circuits (ICx) have recently demonstrated record breaking performances in direct digitization and channeling of RF signals for military and satellite communications in frequency bands from HF to X-band (8-12 GHz) Superconducting ICs offer unparalleled clock frequency of 30 GHz that very soon is going to be increased above 50 GHz allowing for a direct digitization of signals in the K-band (12-18 GHz), K-band (18-26 GHz), and beyond. Multi-channel all-digital RF receivers and other complex RF systems for the Navy, Army and other DoD components can be built by using mult-chip modules. This requires multiple chips on the module to communicate at full clock rates (>20 GHz) and with low cross-talk. The existing techniques of bumping individual superconducting chips is a slow and low yield manual process based on molten solder dipping. It is proposed to develop and transer to HYPRES a technology of the wafer-scale bumping based on bump evaporation (base) and bump electroplating (option) that would allow for a data transfer rates between superconducting chips in excess of 100 Gb/s with high fidelity and yield. It is also proposed to research and transfer the methods of modeling, experimental evaluation and optimization of high-frequency parameters of bump bonds.

Principal Investigator:

Sergey Tolpygo
Director, IC Fabrication
9145921190
stolpygo@hypres.com

Business Contact:

Edward M. Kulinski
VP Finance & Administration
9145921190
ekulinski@hypres.com
Small Business Information at Submission:

HYPRES., INC.
175 Clearbrook Road Elmsford, NY 10523

EIN/Tax ID: 133170343
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Research Institution Information:
SUNY - STONY BROOK
SUNY - Stony Brook
Stony Brook, NY 11794 3362
Contact: Lydia Chabza
Contact Phone: (631) 632-9949
RI Type: Nonprofit college or university