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Company Information:
Name:
DfR Solutions
Address:
5110 Roanoke Place
Suite 101
College Park, MD
Suite 101
College Park, MD
Located in HUBZone:
No
Woman-Owned:
No
Minority-Owned:
No
Phone:
(301) 474-0607
Award Totals:
Award List:
Electronics Reliability Analysis Expert System
Award Year / Program / Phase:
2009 / SBIR / Phase I
Agency / Branch:
DOD / OSD
Principal Investigator:
Robert Esser, Senior Member of Technical Staff
Award Amount:
$99,898.00
Abstract:
The PoF-based software outlined in this proposal addresses the existing and future challenges of reliably incorporating COTS technology into military applications. The most common process for assessing reliability of military designs with COTS parts is MTBF calculations. The use of MTBF… More
Development of Complex Shock and Vibration Model and Reliability Prediction Tool for Pb-free Alloys
Award Year / Program / Phase:
2009 / SBIR / Phase I
Agency / Branch:
DOD / OSD
Principal Investigator:
John McNulty, Director of East Asian Bus. Dev
Award Amount:
$99,941.00
Abstract:
The reliability and performance of Pb-free solders in harsh mechanical environments is not sufficiently understood for use in mission critical applications. Environmental regulations and commercial pressure has reduced the availability of Sn/Pb based com
Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
Award Year / Program / Phase:
2009 / SBIR / Phase I
Agency / Branch:
DOD / OSD
Principal Investigator:
John McNulty, Director of East Asian Business Dev
Award Amount:
$99,643.00
Abstract:
Ball grid array (BGA) commercial off the shelf (COTS) parts with SnPb solder balls are becoming obsolete. The uncertainty of Pb-free solder reliability in severe environments has led to a significant upsurge in reballing within the DoD supply chain. How
Development of Complex Shock and Vibration Model and Reliability Prediction Tool for Pb-free Alloys
Award Year / Program / Phase:
2011 / SBIR / Phase II
Agency:
DOD
Principal Investigator:
Greg Caswell, Sr. Member of the Technic – (301) 474-0607
Award Amount:
$735,755.00
Abstract:
Knowledge of the potential failure mechanisms and their drivers provides a foundation to this proposal, which is designed to assess the impacts of the harsh environmental stresses on the various packaging technologies proposed. From this assessment, the DoD and their supply chain will have a clear… More
Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
Award Year / Program / Phase:
2011 / SBIR / Phase II
Agency / Branch:
DOD / OSD
Principal Investigator:
Joelle Arnold, Member of the Technical S – (301) 474-0607
Award Amount:
$300,000.00
Abstract:
This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs… More