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Company Information:

Company Name:
Foresite, Inc.
Address:
1982 S. Elizabeth St.
Kokomo, IN 46902-
Phone:
(765) 457-8095
URL:
N/A
EIN:
351846313
DUNS:
791785538
Number of Employees:
12
Woman-Owned?:
No
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
STTR Phase I $99,945.00 1
STTR Phase II $2,827,530.00 2

Award List:

Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

Award Year / Program / Phase:
2009 / STTR / Phase I
Award Amount:
$99,945.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Terry Munson, President
Research Institution:
Purdue University
RI Contact:
Carol A. Handwerker
Abstract:
The impact of metal whisker growth on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to process, logistic and economic supplier realities. It is… More

Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

Award Year / Program / Phase:
2010 / STTR / Phase II
Award Amount:
$498,966.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Terry Munson, President
Research Institution:
Purdue University
RI Contact:
Carol Handwerker
Abstract:
The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment… More

Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

Award Year / Program / Phase:
2010 / STTR / Phase II
Award Amount:
$2,328,564.00
Agency / Branch:
DOD / MDA
Principal Investigator:
Terry Munson, President – (765) 457-8095
Research Institution:
Purdue University
RI Contact:
Carol Handwerker
Abstract:
The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment… More