Award Year / Program / Phase:
2010 / STTR / Phase II
Agency / Branch:
DOD / MDA
Research Institution:
Purdue University
The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment…
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