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Thermal Pyrolytic Graphite (TPG) Embedded Copper Graphite Composite Heat Sinking Slat for Phase Array Radar Antenna

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: N00178-05-C-3048
Agency Tracking Number: 044-0846
Amount: $148,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA04-139
Solicitation Number: 2004.4
Timeline
Solicitation Year: 2004
Award Year: 2005
Award Start Date (Proposal Award Date): 2005-04-25
Award End Date (Contract End Date): 2005-10-24
Small Business Information
101 Clematis Avenue, Unit #1
Waltham, MA 02453
United States
DUNS: 809965130
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 YUEJIAN CHEN
 SENIOR R&D ENGINEER
 (781) 893-4449
 ECHEN@MMCCINC.COM
Business Contact
 JAMES CORNIE
Title: CHIEF TECHNOLOGY OFFICER
Phone: (781) 893-4449
Email: JCORNIE@MMCCINC.COM
Research Institution
N/A
Abstract

A manufacturing technique is developed to strategically embed thermal pyrolytic graphite (TPG) insert into copper graphite composite. TPG will then be located in the critical thermal path of phase array radar antenna slat so that the slat is allowed to be cooled from its edge. The enhancement of thermal performance by TPG insertion allows the antenna slat to be cooled at its edge while the advanced wide band gap semiconductors, such as GaN and SiC, are used in the microwave modules. At an average heat flux of 100 W/cm2, which is assumed at the module level for GaN devices, the temperature difference along the thermal path of 1.5" long, in the case of copper graphite composite, from module mounting surface to cooling fins was estimated as only 8 °C, using a simplified one-dimensional heat transfer method. This temperature drop is adequate for the total thermal management of GaN devices whose junction temperature can be as high as 250 °C.

* Information listed above is at the time of submission. *

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