USA flag logo/image

An Official Website of the United States Government

Company Information:

Company Name:
International Micro Industries
Address:
8000 Commerce Pkwy
Mt Laurel, NJ 08054
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
N/A
Woman-Owned?:
Yes
Minority-Owned?:
No
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $199,940.00 4
SBIR Phase II $500,000.00 1

Award List:

IONIZING DOSE RATES

Award Year / Program / Phase:
1986 / SBIR / Phase I
Award Amount:
$50,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Thomas l angelucci sr
Abstract:
The effects of ionizing radiation on dielectric conductivity have been extensively studied by many researchers. much data exist in the literature for materials such as teflon, polyethylene, tantalum, etc., which are commonly used throughout the electronics industry. a need exists to collect and… More

DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S

Award Year / Program / Phase:
1986 / SBIR / Phase I
Award Amount:
$50,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Thomas L Angelucci Sr
Abstract:
N/a

DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S

Award Year / Program / Phase:
1987 / SBIR / Phase II
Award Amount:
$500,000.00
Agency / Branch:
DOD / NAVY
Principal Investigator:
Thomas L Angelucci Sr
Abstract:
This effort will focus on lowering cost and improving per- formance by eliminating ceramic and plastic packages pres- used in surface mounting semiconductor chips. the chip will be mounted directly to a prepared footprint on the printed circuit board (pcb) utilizing advanced tape auto- mated bonding… More

ADVANCED SILICON-ON-SILICON MULTICHIP MODULE DEVELOPMENT FOR AUTOMATED PRODUCTION.

Award Year / Program / Phase:
1991 / SBIR / Phase I
Award Amount:
$49,942.00
Agency / Branch:
DOD / DARPA
Principal Investigator:
Philip Rima , Principal Investigator
Abstract:
Imi proposes to utilize its recent successful packaging research in multichip silicon-on-silicon assemblies to developa high density, high performance design for low coast digital and analog modules. a circuited silicon wafer will be utilized as a substrateon which to mount four or more silicon… More

ADVANCED RESEARCH FOR DEVELOPMENT OF A HYBRID SMART CARD READER IN A PCMCIA FORMAT.

Award Year / Program / Phase:
1994 / SBIR / Phase I
Award Amount:
$49,998.00
Agency:
DOC
Principal Investigator:
Thomas L Angelucci
Abstract:
International micro industries (imi) is well qualified to perform the scientific and engineering research (phase 1) required to define a hybrid smartcard reader (hsr) in a pcmcia card form factor, and to develop it in phase 2. the problem is how to process, interconnect and assemble a number of high… More