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DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S

Award Information

Agency:
Department of Defense
Branch:
Navy
Award ID:
4531
Program Year/Program:
1987 / SBIR
Agency Tracking Number:
4531
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
International Micro Industries
8000 Commerce Pkwy Mt Laurel, NJ 08054
View profile »
Woman-Owned: Yes
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1987
Title: DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S
Agency / Branch: DOD / NAVY
Contract: N/A
Award Amount: $500,000.00
 

Abstract:

THIS EFFORT WILL FOCUS ON LOWERING COST AND IMPROVING PER- FORMANCE BY ELIMINATING CERAMIC AND PLASTIC PACKAGES PRES- USED IN SURFACE MOUNTING SEMICONDUCTOR CHIPS. THE CHIP WILL BE MOUNTED DIRECTLY TO A PREPARED FOOTPRINT ON THE PRINTED CIRCUIT BOARD (PCB) UTILIZING ADVANCED TAPE AUTO- MATED BONDING (TAB) AND NEW CHIP OVERCOATING MATERIALS. A COMMERCIALLY AVAILBLE VLSI SHIP WITH MORE THAN 60 I/O'S WILL BE SELECTED (THE PRIME CANDIDATE IS A CHIP WITH 136 I/O'S) TO BE TAB SURFACE MOUNTED TO PCB'S AND THEN OVER- COATED WITH SPECIALIZED ENCAPSULANTS. PRIOR TO EXCISE AND SURFACE MOUNTING, THE CHIP WILL BE PROCESSED WITH ELEC- TROPLATED GOLD BUMPS ON EACH CHIP BONDING PAD, THEN INNER LEAD BONDED (ILB) TO A 35MM FILM OF POLYIMIDE MATERIAL TO WHICH COPPER FOIL HAS BEEN LAMINATED, AND THE APPROPRIATE CIRCUIT PATTERN ETCHED AND GOLD PLATED. THE ILB PROCESS IS ACCOMPLISHED WITH GANG BONDING, A SINGLE OPERATION THAT BONDS ALL OF THE CIRCUIT LEADS TO THEIR ASSIGNED BONDING PADS. THE SURFACE MOUNTED AND OVERCOATED CIHIP- ON-BOARD WILL BE TESTED AND EVALUATED FOR ENVIRONMENTAL AND

Principal Investigator:

Thomas L Angelucci Sr
0

Business Contact:

Small Business Information at Submission:

International Micro Industries
23 Olney Ave Cherry Hill, NJ 08003

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No