Microscale Seismic and Acoustic Vibration Sensor
Agency / Branch:
DOD / DARPA
Microsensors and actuators based on microelectromechanical (MEM) technology are still in the early development stage with some components, such as accelerometers, now available commercially. Microactuators are still mostly experimental. An excellent application for microsensors and actuators is in vibration sensing and control. Frequency selective vibration sensors using piezoresistive materials on cantilevered beam harmonic oscillators have already been produced in the laboratory. Smart materials including piezoelectric and piezoresistive materials can be applied to vibration sensing in structural components. The purpose of this proposed effort is to produce a device designed to monitor vibrations in equipment and structures, and to optimize the design for manufacturing. The goal is to develop an integrated micromechanical sensor that can be used to measure the vibrational modes of operating equipment in high "g" and other adverse environments. The device will perform an instantaneous fast Fourier transform in the frequency range from very low to ultrasonic frequencies. It will have minimum energy consumption requirements and be extremely small, rugged and lightweight. Anticipated Benefits: Benefits include the development of new devices for measuring vibrations in structures and equipment such as rotorcraft. The commercial production of micromechanical devices is beneficial to the US economy, the integrated circuit processing industry and new MEM processing industry in particular. This project will show the applicability of microscale components to the solutions of engineering problems. These miniature devices have important medical military and commercial uses.
Small Business Information at Submission:
Principal Investigator:Daniel Edmans
105 Jordan Road Troy, NY 12180
Number of Employees: