Ultra-thin-Layer Heterogeneous Stack Manufacturing Process

"Ballistic missile defense system components require cutting edge designs and technologies that are sometimes costly and time consuming to produce. Irvine Sensors Corporation (ISC) proposes to develop a low-cost, reliable process for manufacturing denselypackaged ?systems in a stack? that dramatically reduce the weight and size of MDA electronics systems. This packaging approach is based on the Neo-Stack? technology, which has been developed and feasibility demonstrated at ISC. The goal is to produceheterogeneous miniature stacks containing diverse types of integrated circuits (ICs) in a design and fabrication environment that minimizes time to transition from the breadboard phase to a manufacturing environment adaptable to both defense and commercialapplications. Produces heterogeneous miniature stacks containing diverse types of integrated circuits (ICs) in a design and fabrication environment that minimizes time to transition from the breadboard phase to a manufacturing environment that is adaptableto both defense and commercial products."