Recent work here has demonstrated that silicon nitride can be superplastically forged to near net shape. in this proposal we seek to investigate whether forging also improves the reliability of the components. experience withhigh temperature metallic alloys shows that forging improvesthe… More

This project will investigate the feasibility of obtaining useful texture in high critical temperature (t(c)) yba(2)cu(3)o(7)-x superconducting compounds through isothermal hot extrusion of fine grain powder compacts in the form of a dense wire. the critical temperature and the critical current… More

For electronic packaging applications, the three desirable properties of an insulating ceramic substrate are: high thermal conductivity, thermal expansion match with the device and low dielectric constant. while some monolithic ceramics show promise, an alternative approach is to design and… More