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Company Information:

Company Name:
Jupiter Technologies Inc
Address:
187 Langmuir Lab
Cornell Bus&tech Park Brown Rd
Ithaca, NY 14850
Phone:
N/A
URL:
N/A
EIN:
N/A
DUNS:
N/A
Number of Employees:
N/A
Woman-Owned?:
No
Minority-Owned?:
Yes
HUBZone-Owned?:
No

Commercialization:

Has been acquired/merged with?:
N/A
Has had Spin-off?:
N/A
Has Had IPO?:
N/A
Year of IPO:
N/A
Has Patents?:
N/A
Number of Patents:
N/A
Total Sales to Date $:
$ 0.00
Total Investment to Date $
$ 0.00
POC Title:
N/A
POC Name:
N/A
POC Phone:
N/A
POC Email:
N/A
Narrative:
N/A

Award Totals:

Program/Phase Award Amount ($) Number of Awards
SBIR Phase I $150,000.00 3

Award List:

NITRIDE

Award Year / Program / Phase:
1986 / SBIR / Phase I
Award Amount:
$50,000.00
Agency:
DOE
Principal Investigator:
Dr. prakash c. panda , PRINCIPAL INVESTIGATOR
Abstract:
Recent work here has demonstrated that silicon nitride can be superplastically forged to near net shape. in this proposal we seek to investigate whether forging also improves the reliability of the components. experience withhigh temperature metallic alloys shows that forging improvesthe… More

ENHANCEMENT OF CRITICAL CURRENT DENSITY IN HIGH TEMPERATURE SUPERCONDUCTING CERAMIC WIRE THROUGH HOT-EXTRUSION INDUCED TEXTURE

Award Year / Program / Phase:
1988 / SBIR / Phase I
Award Amount:
$50,000.00
Agency:
DOE
Principal Investigator:
Abstract:
This project will investigate the feasibility of obtaining useful texture in high critical temperature (t(c)) yba(2)cu(3)o(7)-x superconducting compounds through isothermal hot extrusion of fine grain powder compacts in the form of a dense wire. the critical temperature and the critical current… More

GLASS CERAMIC-DIAMOND COMPOSITES FOR ELECTRONIC PACKAGING APPLICATIONS

Award Year / Program / Phase:
1991 / SBIR / Phase I
Award Amount:
$50,000.00
Agency:
NSF
Principal Investigator:
Dr. Prakash C. Panda , Chief Scientist/president
Abstract:
For electronic packaging applications, the three desirable properties of an insulating ceramic substrate are: high thermal conductivity, thermal expansion match with the device and low dielectric constant. while some monolithic ceramics show promise, an alternative approach is to design and… More