Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions
Agency / Branch:
DOD / MDA
In this Phase I proposal, Kyma Technologies will perform a proof of concept demonstration of high quality bulk GaN/diamond integration for advanced thermal management of high power density GaN-based device applications. The development effort will include separation of thin GaN layers from bulk substrates and bonding to diamond.
Small Business Information at Submission:
KYMA TECHNOLOGIES, INC.
8829 Midway West Road Raleigh, NC 27617
Number of Employees: