Microelectromechanical Systems Packaging
Agency / Branch:
DOD / ARMY
Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.
Small Business Information at Submission:
120 East Union Avenue Bound Brook, NJ 08805
Number of Employees: