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Microelectromechanical Systems Packaging

Award Information

Agency:
Department of Defense
Branch:
Army
Award ID:
78558
Program Year/Program:
2006 / SBIR
Agency Tracking Number:
A052-147-2000
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
LASERLITH CORP.
4775 Technology Circle, Suite 3 Grand Forks, ND 58203-5635
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2006
Title: Microelectromechanical Systems Packaging
Agency / Branch: DOD / ARMY
Contract: W31P4Q-06-C-0160
Award Amount: $119,992.00
 

Abstract:

Many standard packaging methods pose problems for high-g MEMS. Wirebonds can fail or drift electrically under high shock conditions. Wafer-level approaches may lack required strength, and impose undesirably high temperatures. The proposed project will assess failure modes for high-g MEMS devices and results will be presented in a database.

Principal Investigator:

Zhixiong Xiao
Optical Engineer
7326488039
LaserlithCo@aol.com

Business Contact:

Maisy Fong
President
7326488039
LaserlithCo@aol.com
Small Business Information at Submission:

LASERLITH CORP.
120 East Union Avenue Bound Brook, NJ 08805

EIN/Tax ID: 222666373
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No