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Thermal Management Techniques for Bonded Electronic Components

Award Information

Agency:
Department of Defense
Branch:
Navy
Award ID:
59629
Program Year/Program:
2002 / SBIR
Agency Tracking Number:
N02-099-08
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2002
Title: Thermal Management Techniques for Bonded Electronic Components
Agency / Branch: DOD / NAVY
Contract: N00178-02-C-3056
Award Amount: $69,960.00
 

Abstract:

"This SBIR Phase I seeks to develop a family of unique highly thermally conductive diamond/epoxy composite adhesives for die attach of power electronic devices. Diamond has a conductivity of above 1800 W/m.K as compared to the conventional epoxy matrixwith a conductivity of 0.2 W/m.K. Hence the incorporation of the diamond filler particles with volume loading, Vf>50% can greatly increase the conductivity of the epoxy matrix to levels above 20-50 W/m.K, whilst retaining high bond strength and ease ofapplication. The most key innovation is to tailor the interface of the diamond particulate filler to allow acoustic coupling with the epoxy matrix for high conductivity by use of coating of the diamond with intermediate acoustic impedance layers with useof self-assembly coupling agents. High conductivity adhesives are essential for heat management in modern power electronic devices. The proposed innovation of using diamond filler will make thermal adhesives specifically for commercial high heat fluxapplications."

Principal Investigator:

Sion Pickard
Senior Scientist
5205741980
pickards@mercorp.com

Business Contact:

J.c. Withers
CEO
5205741980
jwithers@mercorp.com
Small Business Information at Submission:

Materials & Electrochemical Research (Mer) Corp.
7960 S. Kolb Rd. Tucson, AZ 85706

EIN/Tax ID: 860530946
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No