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GRAPHITE REINFORCED MAGNESIUM AS AN ALUMINA MATCHING LOW COEFFICIENT OF THERMAL…

Award Information

Agency:
Department of Defense 		Branch:
Navy 		Award ID:
6094 		Program Year/Program:
1987 / SBIR
Agency Tracking Number:
6094 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
Material Concepts Inc
666 N Hague Ave Columbus, OH 43204
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1987
Title: GRAPHITE REINFORCED MAGNESIUM AS AN ALUMINA MATCHING LOW COEFFICIENT OF THERMAL EXPANSION MATERIAL
Agency / Branch: DOD / NAVY
Contract: N/A
Award Amount: $50,000.00
 

Abstract:

BECAUSE OF ADVANCES IN INTEGRATED CIRCUIT USE AND MANUFACTURE, NEWER LOGIC AND MEMORY CHIPS ARE MORE POWERFUL AND HENCE GIVE OFF MORE HEAT. DIFFICULTIES HAVE BEEN ENCOUNTERED IN BONDING ALUMINUM CHIP CARRIERS TO ALUMINUM SUPPORT STRUCTURES, BECAUSE THE DIFFERENCE IN THERMAL EXPANSION (CTE) OF THESE MATERIALS CAUSES BOND FAILURE AT THE TEMPERATURES CREATED BY THE LARGER CHIP HEAT DISSIPATION. GRAPHITE/MAGNESIUM (GR/MG) COMPOSITE MATERIAL OFFERS AN ATTRACTIVE ALTERNATIVE TO ALUMINUM FOR SUPPORT STRUCTURES, BOTH BECAUSE OF ITS LOW WEIGHT AND GOOD MECHANICAL PROPERTIES AND BECAUSE ITS CTE CAN BE TAILORED TO MATCH THE CTE OF NEARLY ANY CHIP CARRIER MATERIAL. THE PURPOSE OF THIS PROGRAM IS TO DEMONSTRATE THAT CAST GR/MG CAN BE FABRICATED HAVING A QUASI-ISOTROPIC PLANAR CTE MATCHING THAT OF ALUMINA, AND THAT THERMAL CYCLING DOES NOT CAUSE BOND FAILURE BETWEEN THIS MATERIAL AND AN ALUMINA COATING.

Principal Investigator:

Jana l jackson
6142725785

Business Contact:

Small Business Information at Submission:

Material Concepts Inc
666 N Hague Ave Columbus, OH 43204

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No