Rigid-Rod Polymers for Low Cost MCM's
Agency / Branch:
DOD / DARPA
New dielectric films having coefficient of thermal expansion matched to either copper or silicon will be developed based on processable Poly-X (tm) polyphenylenes. These films will have important applications in laminates for Multichip Modules (MCM) and other advanced packaging techniques. The unique combination of rigid-rod backbone and amorphous form will result in film properties not possible with existing materials. Poly-X (tm) resins also have very low dielectric constants and moisture uptake. Anticipated Benefits: Development of low coefficient of thermal expansion dielectric films and laminates will enable low cost fabrication of Multichip Modules.
Small Business Information at Submission:
Principal Investigator:Virgil Lee
140 E. Arrow Hwy. San Dimas, CA 91773
Number of Employees: