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Rigid-Rod Polymers for Low Cost MCM's

Award Information

Agency:
Department of Defense
Branch:
Defense Advanced Research Projects Agency
Award ID:
25446
Program Year/Program:
1996 / SBIR
Agency Tracking Number:
25446
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Maxdem, Inc.
140 East Arrow Highway San Dimas, CA 91773
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 2
Fiscal Year: 1996
Title: Rigid-Rod Polymers for Low Cost MCM's
Agency / Branch: DOD / DARPA
Contract: N/A
Award Amount: $746,505.00
 

Abstract:

New dielectric films having coefficient of thermal expansion matched to either copper or silicon will be developed based on processable Poly-X (tm) polyphenylenes. These films will have important applications in laminates for Multichip Modules (MCM) and other advanced packaging techniques. The unique combination of rigid-rod backbone and amorphous form will result in film properties not possible with existing materials. Poly-X (tm) resins also have very low dielectric constants and moisture uptake. Anticipated Benefits: Development of low coefficient of thermal expansion dielectric films and laminates will enable low cost fabrication of Multichip Modules.

Principal Investigator:

Virgil Lee
9093940644

Business Contact:

Small Business Information at Submission:

Maxdem, Inc.
140 E. Arrow Hwy. San Dimas, CA 91773

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No