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STRUCTURE-PROPERTY RELATIONSHIPS FOR POLYQUINOLINES

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: N/A
Agency Tracking Number: 27352
Amount: $292,441.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
140 E Arrow Hwy
San Dimas, CA 91773
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Virgil Lee
 (909) 394-0644
Business Contact
Phone: () -
Research Institution
N/A
Abstract

A CRITICAL DEFICIENCY EXISTS IN CURRENT DIELECTRIC MATERIALS THAT PREVENTS THEIR USE IN THE NEXT GENERATIONS OF ULTRAFAST COMPUTING SYSTEMS. ORGANIC POLYMERS OFFER THE MOST PROMISE IN THIS AREA AND ARE ALREADY BEGINNING TO DISPLACE INORGANIC MATERIAL SUCH AS SILICON DIOXIDE IN THESE APPLICATIONS DUE TO THE PERFORMANCE ADVANTAGES OFFERED BY ORGANIC SYSTEMS. HOWEVER, CURRENT ORGANIC POLYMERS SUCH AS POLYIMIDES ARE LACKING FOR DIELECTRIC APPLICATIONS AND, THUS, NEW ORGANIC MATERIALS WITH THE RIGHT COMBINATIONS OF PROPERTIES ARE DESIRED. POLYQUINOLINES THAT DO NOT HAVE THE DEFICIENCIES THAT PLAGUE POLYIMIDES AND POLYQUINOLINES ARE IDEALLY SUITED TO SERVE AS DIELECTRIC MATERIALS DUE IN PART TO THEIR INHERENTLY LOW DIELECTRIC CONSTANTS (2.6-2.8), LOW MOISTURE UPTAKES (0.15 PERCENT), AND EXCELLENT THERMAL STABILITIES. IN ADDITION, A FACILE SYNTHESIS OF POLYQUINOLINES HAS RECENTLY BEEN DEVELOPED WHICH GREATLY SIMPLIFIES THEIR PREPARATION AND ALLOWS FOR THE EASY MODIFICATION OF THEIR STRUCTURE TO YIELD NEW POLYQUINOLINE DERIVATIVES. HOWEVER, TRIAL AND ERROR METHODS OF PREPARING NEW DERIVATIVES ARE TOO TIME CONSUMING AND COSTLYBECAUSE OF THE COMPLEX INTERRELATIONSHIPS BETWEEN POLYMER PROPERTIES. THUS, THE ESTABLISHMENT OF STRUCTURE-PROPERTY RELATIONSHIPS ARE ESSENTIAL TO THE DEVELOPMENT OF OPTIMUM POLYQUINOLINE DERIVATIVES FOR DIELECTRIC APPLICATIONS.

* Information listed above is at the time of submission. *

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