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AUTOMATED ELECTRONIC CIRCUIT MANUFACTURING USING INK JET TECHNOLOGY

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
7547
Program Year/Program:
1988 / SBIR
Agency Tracking Number:
7547
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
MicroFab Technologies Inc
1104 Summit Avenue Suite 110 Plano, TX -
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Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 1988
Title: AUTOMATED ELECTRONIC CIRCUIT MANUFACTURING USING INK JET TECHNOLOGY
Agency: NSF
Contract: N/A
Award Amount: $50,000.00
 

Abstract:

THE FEASIBILITY OF PRODUCING ELECTRONIC CIRCUIT BOARDS, FLEXIBLE CIRCUITS, AND INTEGRATED CIRCUIT PACKAGES USING INKJET TECHNOLOGY WILL BE EVALUATED. IF SUCCESSFUL, THIS METHOD COULD BE INTERFACED WITH COMPUTER AIDED DESIGN SYSTEMS TO PRODUCE RAPID TURNAROUND OF PROTOTYPES. PACKAGING IS CURRENTLY ONE OF THE PACING ITEMS IN MOST CUSTOM CIRCUIT DEVELOPMENT. APPLICATION TO FOUR SPECIFIC CIRCUIT PROCESSES WILL BE EVALUATED. IC TAB BONDING CIRCUITS, CONVENTIONAL IC PACKAGING, FLEX CIRCUITS, AND PC BOARDS. THE FEASIBILITY OFPRODUCING THE ABOVE WILL BE EXAMINED USING A VARIETY OF MATERIALS (BOTH CONDUCTIVE AND MASKING) AND SUBSTRATES.

Principal Investigator:

David b wallace
0

Business Contact:

Small Business Information at Submission:

Microfab Technologies Inc
1104 Summit Avenue Suite 110 Plano, TX 75074

EIN/Tax ID:
DUNS: N/A
Number of Employees: N/A
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No