USA flag logo/image

An Official Website of the United States Government

SBIR Phase I: Flip-Chip - Ink Jet Printed Under Bump Metal (UBM) and Lead Free…

Award Information

Agency:
National Science Foundation 		Branch:
N/A 		Award ID:
63766 		Program Year/Program:
2003 / SBIR
Agency Tracking Number:
0319777 		Solicitation Year:
N/A 		Solicitation Topic Code:
N/A 		Solicitation Number:
N/A
Small Business Information
MicroFab Technologies Inc
1104 SUMMIT AVE, STE 110 PLANO, TX 75074-
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: Yes
 
Phase 1
Fiscal Year: 2003
Title: SBIR Phase I: Flip-Chip - Ink Jet Printed Under Bump Metal (UBM) and Lead Free Solder
Agency: NSF
Contract: 0319777
Award Amount: $100,000.00
 

Abstract:

This Small Business Innovation Research Phase I project will develop an environmentally friendly, low cost, fine pitch and high reliability flip chip interconnect for the electronic industry. The ultimate goal of this technology is to develop a process that begins with a semiconductor integrated circuit (IC) with either aluminum (Al) or copper (Cu) bond pads and results in an IC ready for flip-chip bonding using lead-free solder. The Phase I project will demonstrate printing the under bump metal (UBM) on Cu pads using a combination of nanomaterials and thermally converting the deposit into a solder wetable, layered metal film, and printing the lead free solder bumps on the UBM using a high temperature solder-jet printing technology. The commercial applications of this technology could lead to reduced cost and cycle time for the electronic industry. Flip chip performance and size advantages would be available to low volume applications at minimum entry costs. No photolithography, vacuum processes, plating processes or lead are needed. This not only reduces the manufacturing and facilities cost but also replaces historically hazardous processes (photolithography and plating) with an environmental friendly additive process.

Principal Investigator:

Donald Hayes

Business Contact:

Small Business Information at Submission:

MicroFab Technologies Inc
1104 Summit Avenue Suite 110 Plano, TX 75074

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No