Shape Memory Alloy Destruction Mechanism (SMADM)
Agency / Branch:
DOD / OSD
In the event of a physical compromise of a secure system, it may be necessary to physically disable the critical components of the system to ensure that critical hardware and software are rendered not useable for reverse engineering. Mide proposes to utilize the unique properties of shape memory alloys to fragment electrical components and boards in the event of a physical compromise. Shape memory alloys experience a transition from martensite to austenite when they are heated above their transition temperature. In martensite the material is very malleable, in austenite the material returns to its memorized shape and is capable of providing significant force. Mide proposes to memorize the shape memory alloy in a wave pattern and insert it into a PC board or electrical component. In the event of a breach, a large amount of current would surge through the electrical system destroying the software and causing the entire system to heat, which would in turn actuate the SMA to physically destroy the board.
Small Business Information at Submission:
Marthinus C. van Schoor
Chief Executive Officer
Chief Financial Officer
MIDE TECHNOLOGY CORP.
200 Boston Avenue Suite 1000 Medford, MA 02155
Number of Employees: