Advanced Development for Defense Science and Technology
Agency / Branch:
DOD / DARPA
The material science and fabrication aspects of photo-sensitive materials has undergone a revolution in sensitivity and capability. These improvements have taken place in lock step with technology developments in the IC industry. The basic technology of cooling of focal plane arrays (FPA) has been around for the past forty years. It breaks down into two methodologies; mechanical (Stirling) and electrical (thermoelectric). Both have been the recipients of a significant amount of DoD research to improve their performance, SWAP (size, weight and power) and cost efficiency. However, both are macro devices, which are reaching their fundamental limits in reducing SWAP and cost. What is proposed is a MEMs structure that combines active thermoelectric cooling integrated at a material/device level with the photosensitive element. The Phase I proposal has two(2) parts: 1) conduct a feasibility study which would define the concept by creating a model of the device to determine both theoretical as well as existing operating capabilities and 2) investigate an existing compound, using recently developed deposition process, as one potential thermoelectric material system.
Small Business Information at Submission:
MILSYS TECHNOLOGIES, LLC
408 E. Fourth Street Suite 204 Bridgeport, PA 19405
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