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STTR Phase I: Packaging of MEMS Inertial Sensors for Mechanically Harsh Environments

Award Information
Agency: National Science Foundation
Branch: N/A
Contract: 0339954
Agency Tracking Number: 0339954
Amount: $99,998.00
Phase: Phase I
Program: STTR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2004
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
4811A Bradford Drive
Huntsville, AL 35805
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Michael Kranz
 PI
 (256) 533-3233
 mkranz@morganres.com
Business Contact
 Debbie Gerrity
Phone: (256) 533-3233
Email: dgerrity@morganres.com
Research Institution
 Auburn University
 Robert Dean
 
202 Samford Hall
Auburn, AL 36849
United States

 (334) 844-1838
 Nonprofit College or University
Abstract

This Small Business Technology Transfer Phase I Project will investigate the feasibility of integrating advanced vibration isolation packaging technology with Micro-electro-mechanical systems (MEMS) inertial (translational and rotational hybrid) sensors to yield packaged MEMS inertial sensors suitable for mechanically harsh environments, such as automotive and space. To date, many MEMS inertial sensors have been precluded from such applications due to their susceptibility to high frequency vibrations present in these environments. The patent pending vibration isolation packaging technology developed will consist of semi-active mechanical low-pass filters fabricated using MEMS fabrication techniques. This design will be utilized inside microelectronic packaging as high frequency vibration isolation platforms. This effort will combine those two technologies to demonstrate feasibility of the vibration filtering system for MEMS inertial sensors. The primary commercial applications envisioned are in the automotive and industry sector requiring sensor operation in harsh environments. The technologies developed in this work will target those markets that require MEMS sensor performance, in the face of vibrations, above what is currently available. The use of semi-active mechanical damping can improve sensor performance, and hence overall system performance, without large increases in size or cost. Companies who are developing MEMS-based sensors for a variety of applications would be potential customers. These companies would benefit from the availability of an active filtering package for MEMS sensors and could easily integrate the package with their sensor.

* Information listed above is at the time of submission. *

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