NDI for Diffusion Bonded Components
Agency / Branch:
DOD / USAF
It is proposed to use spin dependent tunneling (SDT) and giant magnetoresistance (GMR) magnetic sensors and eddy current techniques for Non-Destructive Inspection (NDI) to detect flaws in various metallic components including cracks around rivet holes andfailed bonds in diffusion bonded components. This Phase II proposal is directed towards designing, optimizing, manufacturing, and demonstrating several GMR and SDT eddy current probes and probe arrays specifically designed to detect varying crack depths,crack sizes, and surface configurations. The design of the sensors used in these probes will be further optimized to maximize resolution and sensing depth based on the results of the Phase I project. The sensors also include hybrids sensors using ASICchips for on-board signal processing or multiplexing. The optimization of on-board excitation coils started in Phase I will also be pursued. We will continue our contacts with aerospace and other interested companies during this Phase II project.Commercialization of the technology is proceeding through the formation of a class S company, Albany Instruments, Inc., a subcontractor on this proposal. At the end of the project we will have prototype sensors and sensor arrays designed to meet specificNDI applications. These prototypes will be ready for Phase III commercialization.
Small Business Information at Submission:
Chief Financial Officer
NONVOLATILE ELECTRONICS, INC.
11409 Valley View Road Eden Prairie, MN 55344
Number of Employees: