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STTR Phase I: Fully Embedded Optical Interconnect Layers Based on Molded…

Award Information

Agency:
National Science Foundation
Branch:
N/A
Award ID:
80108
Program Year/Program:
2006 / STTR
Agency Tracking Number:
0539538
Solicitation Year:
N/A
Solicitation Topic Code:
N/A
Solicitation Number:
N/A
Small Business Information
Omega Optics, Inc.
10306 Sausalito Dr Austin, TX -
View profile »
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
 
Phase 1
Fiscal Year: 2006
Title: STTR Phase I: Fully Embedded Optical Interconnect Layers Based on Molded Polymer Lightwave Components for Large Field Size Printed Circuit Boards
Agency: NSF
Contract: 0539538
Award Amount: $100,000.00
 

Abstract:

This Small Business Technology Transfer (STTR) Phase I project aims at developing a commercially viable optical interconnect technology. Conventional optical interconnect technologies suffer from planar optical waveguides with small dimensions in the vertical direction, which leads to alignment difficulties, laser coupling efficiency reduction, and deteriorated packaging reliability. These optical interconnect technologies also fail to provide transmission over a large field size, and the insertion of optical interconnects is incompatible with electronic device packaging. In this program, it is proposed to develop a fully embedded optical interconnection layer within the three dimensional (3D) electrical interconnect layers using molded optical waveguides in conjunction with thin film lasers and thin film photodetectors (both ~ 10 micron in thickness). The selection of polymer based molded waveguides solves two pending problems, the small field size of the interconnects and the shallow depth of the waveguides. The proposers intend to demonstrate up to 24"x36" molded waveguide films having waveguide dimensions of 50 microns by 50 microns, which make the alignment, and therefore packaging, of laser diodes and photodetectors highly reliable. Such a waveguide depth is not economically feasible using any other waveguide technologies. Commercially, using current communication devices, future data transmission demands at the printed circuit board and system level will be difficult to achieve with current copper interconnect technology due to issues regarding signal attenuation, electromagnetic interference, and parasitic noise. The state of the art electrical interconnect technology is anticipated to hit a deadlock between 2008 and 2012 at speeds above 10Gb/s. The proposed research provides a unique solution that reliably incorporates the optical interconnects into printed circuit board (PCB) fabrication and integration. The result of this research program will lay a solid foundation for a future PCB industry, which is critical for the United States to lead the market for the years to come.

Principal Investigator:

Wei Jiang
Dr
5129968833
wei.jiang@omegaoptics.com

Business Contact:

Diane Chen
5129968833
diane.chang@eomegaoptics.com
Small Business Information at Submission:

Omega Optics
10435 Burnet Road Austin, TX 78758

EIN/Tax ID:
DUNS: N/A
Number of Employees:
Woman-Owned: No
Minority-Owned: No
HUBZone-Owned: No
Research Institution Information:
Univ of TX Austin
J J Pickle Research Campus
Austin, TX 78758
Contact: Ray T. Chen
Contact Phone: (512) 471-7035
RI Type: Nonprofit college or university